Diffusion bonding of Si(3)N(4)-TiN composite with nickel-based interlayers

From: Metallurgical and Materials Transactions | Date: August 1, 2003| Author: Colin, C; Frety, N; Deschaux-Beaume, F | Copyright information

The diffusion bonding of a Si^sub 3^N^sub 4^-TiN composite with Ni, INVAR (Fe-Ni alloy), and IN600 (Ni-Cr-Fe alloy) interlayers has been investigated between 1100 [degrees]C and 1350 [degrees]C, under argon or nitrogen atmosphere. For the chosen bonding conditions, the Si^sub 3^N^sub 4^ phase of the composite reacts with the interlayer phase, leading to the release of silicon and nitrogen, whereas the TiN phase remains stable. The bonding mechanisms with nickel and INVAR (Ni-Fe alloy) interla...

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