The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

From: JOM | Date: June 1, 2003| Author: | Copyright information

The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag^sub 3^Sn. Ag^sub 3^Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing ...

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