ALEXANDRIA, Va., Aug. 25 -- Dong-Yun Li, Jian Yang and Jing Zhang, all from Shenzhen, China, have developed a heat sink assembly with supporting clip. The inventors were issued U.S. Patent No. 7,576,989 on Aug. 18.

The patent has been assigned to Fu Zhun Precision Industry (Shen Zhen) Co. Ltd., Shenzhen, and Foxconn Technology Co. Ltd., Tu-Cheng, Taiwan.

According to the abstract released by the U.S. Patent & Trademark Office: "A heat sink assembly includes an unit and a plurality of fasteners extending through the unit for fixing the unit to a heat-generating electronic component. Each ...

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