A new and truly selective direct metallization process based on conductive polymers. From: CircuiTree | Date: October 1, 2002| Author: Thieme, Tom; Barthelmes, Jurgen | COPYRIGHT 2002 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan.  All inquiries regarding rights should be directed to the Gale Group.Copyright information

A new direct metallization process, based on the formation of a conductive polymer for Plating Through Hole (PTH) and Blind Micro-Via (BMV) plating, meets the reliability demands for High Density Interconnects (HDI) PCB and packaging applications.

Due to reduced investment and running costs, their environmental friendliness and the low space requirements, Direct Metalization (DM) processes became very popular in the 1990s. The DM sequences themselves can be divided into ...