Stencil Technology and Design Guidelines for Print Performance. Circuits Assembly | March 1, 2001| | COPYRIGHT 2001 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan.  All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information) Copyright

Three major performance issues exist for solder paste printing. First, the aperture size (width and length of the aperture) and stencil foil thickness determine the potential volume of solder paste applied to the printed circuit board (PCB) or substrate. The second issue is the ability of the solder paste to release from the stencil aperture walls. The third issue is positional accuracy of exactly where the solder brick is printed onto the PCB or substrate.

As the squeegee blade travels across the stencil during the print cycle, solder paste fills the stencil ...

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