Coupling behavior between transmission lines with meshed ground planes in LTCC-MCMs.(low temperature cofired ceramics-multilayer ceramic modules)

From: Microwave Journal | Date: November 1, 1998| Author: Thust, H.; Drue, K.H.; Muller, J.; Thelemann, T.; Tuschick, T.; Chilo, J.; Golovanov, C.; Ndagijimana, F. | Copyright information

Multilayer ceramic modules for high speed digital applications use meshed planes between the signal layers for shielding and power supply. Both wave impedances of the signal lines and coupling behavior between different signal layers are influenced by the properties of these meshed planes. Former investigations have shown that for a constant metallization rate (aperture ratio) and a given line width, the wave impedance is nearly constant over a wide range of grid pitches. The coupl...

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