Copper Stud Bumping for Flip-Chip Applications.

From: Semiconductor International | Date: June 1, 2006| Author: Chaudhuri, Arun; Levine, Lee; Stepniak, Frank | Copyright information

Lee Levine, Kulicke & Soffa Industries Inc., Willow Grove, Pa., www.kns.com, Arun Chaudhuri and Frank Stepniak, Delphi Electronics & Safety, Kokomo, Ind., www.delphi.com

Approaching 10% of the entire interconnection market, flip-chip devices are one of the highest growth segments of semiconductor assembly. However, higher assembly cost has hampered flip-chip growth in consumer electronics, limiting its adoption to applications with requirements for a smaller footprint (c...

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