Increasing process reliability in fine-pitch wire bonding: a 2-year study identifies close ties between capillary performance and bonding failures.(Wire Bonding) From: Circuits Assembly | Date: March 1, 2006| Author: | COPYRIGHT 2006 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan.  All inquiries regarding rights should be directed to the Gale Group.Copyright information

During wire bonding, process reliability plays an important role in overall device assembly cost. Reliability refers to the probability that a wire bonder will perform its required functions satisfactorily under specific conditions and within a certain time period. Frequent bonding interruptions due to bonding failures, bonder subassembly parts problems, package type and an inadequate process window can lead to lower yields and downtime in the wire bonding process in addition to disturbing factory operations planning and product quality.

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