Study on squeezing flow during nonisothermal embossing of polymer microstructures.

From: Polymer Engineering and Science | Date: May 1, 2005| Author: Kim, Byung; Virupaksha, Vinayshankar L.; Yao, Donggang | Copyright information

A numerical simulation of the hot embossing process with nonisothermal embossing conditions was carried out to observe the flow pattern of poly(methyl methacrylate) into microcavities. The microcavity was isomorphically downsized. The ratio of the cavity width over the cavity thickness was maintained constant at 8:1 throughout the analysis, while the cavity thickness varied from 200 [micro]m to 0.5 [micro]m. It was found that as the microcavity was downsized, the filling mechanism varied. F...

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