Today's high-speed logic demands major advances in circuit design and packaging. (EW Design Engineers' Handbook & Manufacturers Directory)

From: Journal of Electronic Defense | Date: January 1, 1992| Author: Cheriff, Frank J.; Morrison, Brian D.; Rosenberg, Jack J. | Copyright information

TODAY'S HIGH-SPEED LOGIC DEMANDS MAJOR ADVANCES IN CIRCUIT DESIGN AND PACKAGING

Advanced high-performance systems require fast logic and memory circuits in order to meet data and signal processing requirements. VHSIC (very high speed integrated circuits) and other high-speed logic (GaAs, ECL, FAST, FACT, and AS)(*) require major advances in circuit design and packaging philosophy to achieve high performance in a reliable fashion.

In the past, digital systems for...

Related newspaper, magazine, and journal articles from HighBeam Research

Today's high-speed logic demands major advances in circuit design and packaging. (EW Design Engineers' Handbook & Manufacturers Directory)
Journal of Electronic Defense ; TODAY'S HIGH-SPEED LOGIC DEMANDS MAJOR ADVANCES IN CIRCUIT DESIGN AND PACKAGING Advanced high-performance systems require fast logic and memory circuits in order to meet data and signal processing requirements. VHSIC (very high speed integrated circuits) and other high-speed logic (GaAs, ECL, FAST,
TiaLinx, Inc. Announces SBIR Phase I Award from U.S. Army; Project to Develop a Wall Interrogator for Advanced High-Resolution Mapping of Material Topography
U.S. Newswire ; To: TECHNOLOGY EDITORS Contact: Fred Mohamadi of TiaLinx, Inc., +1-949-748-7575, or pr@TiaLinx.com NEWPORT BEACH, Calif., Jan. 5 /PRNewswire/ -- TiaLinx, Inc., a developerof Wafer Scale Antenna Module, today announced that it has been awarded aPhase I from the Army. The objective of this program
Macrosemi Corp. (Industry News).(MMSM wafer scale antenna switch technology)(Brief Article)
Microwave Journal ; Macrosemi Corp. has received 10 new design wins for its patented MMSM wafer scale antenna switch technology used in 802.11a and HiperLAN2 type wireless LAN access points and PC cards.
TiaLinx Reports SBIR Phase I Award from the Office of Naval Research
Wireless News ; Wireless News 05-27-2007 TiaLinx Reports SBIR Phase I Award from the Office of Naval Research WIRELESS NEWS-May 27, 2007-TiaLinx Reports SBIR Phase I Award from the Office of Naval Research (C)2007 10Meters - http:// www.10meters.com TiaLinx, a developer ...
David McComb new FlipChip VP of sales and marketing.(Power People)
CircuiTree ; Phoenix -- FlipChip International, LLC (FCI), appointed David McComb global vice president of sales and marketing for its wafer scale packaging and bumping business.
FlipChip International Names David McComb as VP Sales and Marketing
Wireless News ; Wireless News 09-30-2007 FlipChip International Names David McComb as VP Sales and Marketing WIRELESS NEWS-September 30, 2007-FlipChip International Names David McComb as VP Sales and Marketing (C)2007 10Meters - http:// www.10meters.com FlipChip ...
Barrett appointed new FlipChip VP.(Power People)
CircuiTree ; Phoenix -- Scott T. Barrett was appointed FlipChip International (FCI) LLC's vice president Asian business development for its semiconductor wafer scale packaging and bumping business in Phoenix and its FCMS joint venture in Shanghai. Barrett brings more than 24 years of experience in the
FlipChip appoints Crayon to VP position.(Power People News)
CircuiTree ; Phoenix -- Marcus Crayon has been named vice president quality for FlipChip International's semiconductor wafer scale packaging and bumping business in Phoenix, replacing Terry Lubsen, who is retiring. Crayon brings over 16 years of quality management, reliability, and continuous improvement in
GaAs VCSEL substrate. (New Products).
Fiberoptic Product News ; ULM-photonics Germany www.ulm-photonics.de ULM-photonics' 850 nm TRANSSUB-VCSEL , now sampling at 3.125 Gb/s, has been grown as a bottom emitter with topside P and N contacts, emitting in the direction of the substrate. On the wafer scale a 100 to 300 [micro]m thick transparent glass substrate can
GaAs VCSEL substrate.(New Products)
Fiberoptic Product News ; ULM-photonics Germany www.ulm-photonics.de ULM-photonics' 850 nm TRANSSUB-VCSEL , now sampling at 3.125 Gb/s, has been grown as a bottom emitter with topside P and N contacts, emitting in the direction of the substrate. On the wafer scale a 100 to 300 [micro]m thick transparent glass substrate can